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Case Studies

Thermal IC Encapsulation System

Application / Function

Designed to precisely pick and place IC cap to high temperature sealing station for encapsulation

Key Feature / Technology

  • Fully automated with precision alignment
  • Vision check for orientation and presence
  • High placement accuracy of cap to strips
  • Tailor made heater with high temperature accuracy
  • Reduction of manual handling on sensitive products
  • Convertible to other products packages
  • Easy maintenance
  • Network compatible for Data management e.g SECS/GEM
  • And more…

Labour Substitution and Productivity Data

  • Semi-auto process to full automation
  • Reduce labour numbers and cost
  • Improve product quality and output
  • Eliminate handling processes and improve overall finished goods yield
  • And more…